The Challenge
Imaging spectrometers capture bothspatial and spectral information for applications such as materialidentification, environmental monitoring, and industrial sensing. Theirperformance depends not only on optical filters and photodetectors but also onthe electrical readout and signal processing circuits. Designing compactimaging spectrometers requires efficient readout integrated circuits (ROICs)and controller architectures that provide accurate signal acquisition whilemaintaining low noise, high dynamic range, and low power consumption.
This project explores electricalsignal processing ASIC architectures for imaging spectrometers, focusing on theintegration of photodetector readout, signal conditioning, and mixed-signalcircuit design. System-level modeling and circuit simulations will be used toevaluate the interactions between optical response, detector characteristics,and electrical readout performance.
What You Will Do
You will get the chance to:
Your design work will be supportedby system-level analysis and circuit simulations to understand how electricaldesign choices influence imaging spectrometer performance. You will also havethe opportunity to collaborate with experienced researchers and engineers in aninternational multidisciplinary research environment.
Requirements
The project offers experience inanalog and mixed-signal ASIC design, sensor interface circuits, and electricalsignal processing for imaging spectrometers. A background in electricalengineering, electronic circuits, semiconductor devices, or integrated circuitdesign is desirable. Experience with circuit simulation tools,Verilog/SystemVerilog, Python, or MATLAB is an advantage. The balance betweenarchitecture development, circuit design, and system-level analysis can beadjusted to the candidate's background and interests. A strong command ofEnglish is essential for effective communication.
Time Distribution
40% ASIC architecture and circuitdesign, 30% modeling and simulation, 20% verification and characterization, 10%literature study and reporting
Type of internship: Master internship
Duration: 12months
Required educational background: Electrotechnics/Electrical Engineering
University promotor: Jan Genoe (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Jaewon Nam (< E-Mail aus Sicherheitsgründen gelöscht >) and Gokhan Kara (< E-Mail aus Sicherheitsgründen gelöscht >)
The reference code for this position is 2026-INT-325. Mention this reference code in your application.
Only for self-supporting students.
Applications should include the following information:
Incomplete applications will not be considered.
Imaging spectrometers capture bothspatial and spectral information for applications such as materialidentification, environmental monitoring, and industrial sensing. Theirperformance depends not only on optical filters and photodetectors but also onthe electrical readout and signal processing circuits. Designing compactimaging spectrometers requires efficient readout integrated circuits (ROICs)and controller architectures that provide accurate signal acquisition whilemaintaining low noise, high dynamic range, and low power consumption.
This project explores electricalsignal processing ASIC architectures for imaging spectrometers, focusing on theintegration of photodetector readout, signal conditioning, and mixed-signalcircuit design. System-level modeling and circuit simulations will be used toevaluate the interactions between optical response, detector characteristics,and electrical readout performance.
What You Will Do
You will get the chance to:
- Investigate ROIC and controller ASIC architectures, including detector biasing, signal integration, amplification, sampling, and analog-to-digital conversion.
- Develop behavioral and circuit-level models to evaluate electrical signal processing requirements and system performance.
- Design and simulate analog and mixed-signal circuits for photodetector interfaces using appropriate EDA tools.
- Evaluate optical-electrical system trade-offs, including noise, dynamic range, spectral accuracy, acquisition speed, and power consumption.
- Support circuit verification and prototype evaluation, potentially including layout-related activities and experimental characterization.
Your design work will be supportedby system-level analysis and circuit simulations to understand how electricaldesign choices influence imaging spectrometer performance. You will also havethe opportunity to collaborate with experienced researchers and engineers in aninternational multidisciplinary research environment.
Requirements
The project offers experience inanalog and mixed-signal ASIC design, sensor interface circuits, and electricalsignal processing for imaging spectrometers. A background in electricalengineering, electronic circuits, semiconductor devices, or integrated circuitdesign is desirable. Experience with circuit simulation tools,Verilog/SystemVerilog, Python, or MATLAB is an advantage. The balance betweenarchitecture development, circuit design, and system-level analysis can beadjusted to the candidate's background and interests. A strong command ofEnglish is essential for effective communication.
Time Distribution
40% ASIC architecture and circuitdesign, 30% modeling and simulation, 20% verification and characterization, 10%literature study and reporting
Type of internship: Master internship
Duration: 12months
Required educational background: Electrotechnics/Electrical Engineering
University promotor: Jan Genoe (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Jaewon Nam (< E-Mail aus Sicherheitsgründen gelöscht >) and Gokhan Kara (< E-Mail aus Sicherheitsgründen gelöscht >)
The reference code for this position is 2026-INT-325. Mention this reference code in your application.
Only for self-supporting students.
Applications should include the following information:
- resume
- motivation
- current study
Incomplete applications will not be considered.
