Scanning Electron Microscopy (SEM) is an essential metrology technique in semiconductor
manufacturing, enabling high-resolution imaging of device structures and material layers.
Both top-view and cross-sectional SEM inspections are widely used to monitor process
quality and support technology development.
This thesis focuses on developing and optimizing a workflow for SEM cross-section
inspections. The student will investigate and optimize the key preparation and inspection
steps, including sample capping, cross-section cutting, and SEM imaging. Various imaging
parameters such as pixel resolution, dwell time, line integration, and image integration will
be evaluated to determine their impact on image quality.
Based on experimental results, objective image quality criteria will be defined and used to
identify the optimal inspection conditions. The student will also develop standardized
pattern and beam templates to establish a robust and uniform methodology for SEM
cross-section analysis.
This project offers hands-on experience with advanced semiconductor metrology tools and
provides an opportunity to contribute directly to the optimization of inspection methods
used in a state-of-the-art semiconductor fabrication environment
Type of internship: Master internship
Duration: 3 months
Required educational background: Chemistry/Chemical Engineering, Materials Engineering, Nanoscience & Nanotechnology, Physics
Supervising scientist(s): For further information or for application, please contact Felix Seidel (< E-Mail aus Sicherheitsgründen gelöscht >)
The reference code for this position is 2026-INT-341. Mention this reference code in your application.
Only for self-supporting students.
Applications should include the following information:
Incomplete applications will not be considered.
manufacturing, enabling high-resolution imaging of device structures and material layers.
Both top-view and cross-sectional SEM inspections are widely used to monitor process
quality and support technology development.
This thesis focuses on developing and optimizing a workflow for SEM cross-section
inspections. The student will investigate and optimize the key preparation and inspection
steps, including sample capping, cross-section cutting, and SEM imaging. Various imaging
parameters such as pixel resolution, dwell time, line integration, and image integration will
be evaluated to determine their impact on image quality.
Based on experimental results, objective image quality criteria will be defined and used to
identify the optimal inspection conditions. The student will also develop standardized
pattern and beam templates to establish a robust and uniform methodology for SEM
cross-section analysis.
This project offers hands-on experience with advanced semiconductor metrology tools and
provides an opportunity to contribute directly to the optimization of inspection methods
used in a state-of-the-art semiconductor fabrication environment
Type of internship: Master internship
Duration: 3 months
Required educational background: Chemistry/Chemical Engineering, Materials Engineering, Nanoscience & Nanotechnology, Physics
Supervising scientist(s): For further information or for application, please contact Felix Seidel (< E-Mail aus Sicherheitsgründen gelöscht >)
The reference code for this position is 2026-INT-341. Mention this reference code in your application.
Only for self-supporting students.
Applications should include the following information:
- resume
- motivation
- current study
Incomplete applications will not be considered.
