Scanning probemicroscopy (SPM) is a powerful technique for characterizing materials and devices atthe nanometre scale, but the measurement quality depends directly on the SPM tip. Blunt,irregular, or multi-contact tips produce convolution artefacts that reduceaccuracy and require frequent replacement. Depending on the instrument,operating mode, and experimental environment, changing a tip can take from tenminutes to several hours. Extensiveresearch has therefore focused on innovative solutions, with reverse tip sample (RTS) SPM, developed at imec, emerging as aparticularly promising approach.
In RTS SPM, the sampleis placed on a tipless cantilever and is scanned over a tip integrated into theRTS tip chip, which contains thousands of such tips. This configuration allowsfor tip exchanges within a few seconds, a dramatic improvement compared totraditional SPM, simply by repositioning the sample above any adjacent, unusedtip. In just a few years, the RTS technology has further advanced and severalRTS tip chip prototypes tailored for different applications have been demonstrated.These include chips equipped with bare silicon tips for topographical mapping,platinum coated tips for electrical SPM, and conductive diamond tip variantsdesigned for high-force electrical measurements.
This project aims to improve the reproducibility and yield of an existing dry-etching process for silicon tip structures by transferring it froman older research etching tool to a newer, more advanced etchingreactor. Key target parameters are a silicon tip height of 8-12 µm, a tip-on-pedestalgeometry, and a tip radius of 10-50 nm. The fabricated silicon tips will be coated with thin diamond filmsand further patterned by dry etching. The project will also establish rigorous, efficient characterization methods to enable rapidfeedback and continuous process improvement. The student will performlithography, etching, and deposition in imec's state-of-the-art cleanroom, evaluate tip performance in a well-equipped SPM laboratory, andsummarize the results in a scientific publication.
Type of internship: Master internship, PhD internship
Duration: 6 months (or 12 months for NNFC students)
Required educational background: Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology, Materials Engineering
University promotor: Claudia Fleischmann (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Lennaert Wouters (< correo electrónico eliminado por razones de seguridad >) and Nemanja Peric (< correo electrónico eliminado por razones de seguridad >) and Thomas Hantschel (< correo electrónico eliminado por razones de seguridad >)
The reference code for this position is 2026-INT-347. Mention this reference code in your application.
Imec allowance will be provided.
Applications should include the following information:
Incomplete applications will not be considered.
In RTS SPM, the sampleis placed on a tipless cantilever and is scanned over a tip integrated into theRTS tip chip, which contains thousands of such tips. This configuration allowsfor tip exchanges within a few seconds, a dramatic improvement compared totraditional SPM, simply by repositioning the sample above any adjacent, unusedtip. In just a few years, the RTS technology has further advanced and severalRTS tip chip prototypes tailored for different applications have been demonstrated.These include chips equipped with bare silicon tips for topographical mapping,platinum coated tips for electrical SPM, and conductive diamond tip variantsdesigned for high-force electrical measurements.
This project aims to improve the reproducibility and yield of an existing dry-etching process for silicon tip structures by transferring it froman older research etching tool to a newer, more advanced etchingreactor. Key target parameters are a silicon tip height of 8-12 µm, a tip-on-pedestalgeometry, and a tip radius of 10-50 nm. The fabricated silicon tips will be coated with thin diamond filmsand further patterned by dry etching. The project will also establish rigorous, efficient characterization methods to enable rapidfeedback and continuous process improvement. The student will performlithography, etching, and deposition in imec's state-of-the-art cleanroom, evaluate tip performance in a well-equipped SPM laboratory, andsummarize the results in a scientific publication.
Type of internship: Master internship, PhD internship
Duration: 6 months (or 12 months for NNFC students)
Required educational background: Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology, Materials Engineering
University promotor: Claudia Fleischmann (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Lennaert Wouters (< correo electrónico eliminado por razones de seguridad >) and Nemanja Peric (< correo electrónico eliminado por razones de seguridad >) and Thomas Hantschel (< correo electrónico eliminado por razones de seguridad >)
The reference code for this position is 2026-INT-347. Mention this reference code in your application.
Imec allowance will be provided.
Applications should include the following information:
- resume
- motivation
- current study
Incomplete applications will not be considered.
