Mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren

Particle-induced bond defects manifest as relatively large voids trapped between wafers and split the oncoming bond front. Such voids not only create locally unbonded gaps in the vicinity of the particle, but also create a tail of voids downstream, in the direction of the front's propagation, as the split- bond- fronts collide with each other in closing the unbonded region. We aim to visualize this parasitic effect of void-tail formation using high-speed imaging, and fully characterize their formation in terms of the mechanical parameters of the system.

Type of internship: Master internship

Required educational background: Physics, Mechanical Engineering

University promotor: Pierre-Thomas Brun (KU Leuven)

Supervising scientist(s): For further information or for application, please contact Steven Brems (< correo electrónico eliminado por razones de seguridad >) and Serena Iacovo (< correo electrónico eliminado por razones de seguridad >) and Utkarsh Jain (< correo electrónico eliminado por razones de seguridad >)

The reference code for this position is 2026-INT-252. Mention this reference code in your application.

Applications should include the following information:

• resume
• motivation
• current study

Incomplete applications will not be considered.