As microelectronic devices continue to scale down, their architectures and fabrication processes are becoming increasingly complex. This leads to the formation of numerous nanoconfined features that require precise cleaning and etching. However, as feature sizes shrink and aspect ratios increase, achieving uniform etching becomes more challenging. In particular, wet etching processes are strongly influenced by confinement effects, with narrower features exhibiting reduced etch rates, a phenomenon known as pattern loading.
Despite its importance, the fundamental origins of pattern loading remain unclear. It is not yet established whether this effect is governed primarily by geometric confinement and diffusion effects or by the specific reaction mechanisms and material properties involved.
This internship project aims to systematically investigate etching behavior in nanoconfined structures across different material systems (oxides, metals, and nitrides), each governed by distinct rate-limiting steps. The study will focus on:
• Understanding how material-dependent etching kinetics influence confinement effects and pattern loading
• Investigating the role of surface properties, such as wall charge, on etching behavior in nanoconfinements
The project involves the use of advanced characterization techniques, including SEM, TEM, solid-surface zeta-potential, ellipsometry. Successful results are expected to lead to publication in a peer-reviewed journal.
Candidate profile:
• Master's student in chemistry, chemical engineering, material science or a related field
• Prior experience working in a chemical laboratory
Type of internship: Master internship
Required educational background: Chemistry/Chemical Engineering
Supervising scientist(s): For further information or for application, please contact Alina Arslanova (< email supprimé pour raison de sécurité >)
The reference code for this position is 2026-INT-182. Mention this reference code in your application.
Applications should include the following information:
Incomplete applications will not be considered.
Despite its importance, the fundamental origins of pattern loading remain unclear. It is not yet established whether this effect is governed primarily by geometric confinement and diffusion effects or by the specific reaction mechanisms and material properties involved.
This internship project aims to systematically investigate etching behavior in nanoconfined structures across different material systems (oxides, metals, and nitrides), each governed by distinct rate-limiting steps. The study will focus on:
• Understanding how material-dependent etching kinetics influence confinement effects and pattern loading
• Investigating the role of surface properties, such as wall charge, on etching behavior in nanoconfinements
The project involves the use of advanced characterization techniques, including SEM, TEM, solid-surface zeta-potential, ellipsometry. Successful results are expected to lead to publication in a peer-reviewed journal.
Candidate profile:
• Master's student in chemistry, chemical engineering, material science or a related field
• Prior experience working in a chemical laboratory
Type of internship: Master internship
Required educational background: Chemistry/Chemical Engineering
Supervising scientist(s): For further information or for application, please contact Alina Arslanova (< email supprimé pour raison de sécurité >)
The reference code for this position is 2026-INT-182. Mention this reference code in your application.
Applications should include the following information:
- resume
- motivation
- current study
Incomplete applications will not be considered.
