Gå til indhold

RF Interposer for High-Bandwidth Co-Packaged Optics

Bachelor eller Kandidatspeciale

Leuven (Belgium)

Offentliggjort den 20. oktober 2026

  • Opslagstype

    Bachelor eller Kandidatspeciale

  • Sted

    Leuven (Belgium)

  • Startdato

    Så hurtigt som muligt

  • Løn

    Oplysninger ikke angivet

  • Hjemmearbejde

    Ikke specificeret

his Master's thesis will investigate RF interposer technology as a heterogeneous integration platform for co-packaged optics. The work will explore system architectures integrating RF/electronic and photonic chiplets and will focus on the design, modeling, and optimization of high-speed interconnects and critical integration structures. Key parameters such as insertion loss, return loss, bandwidth, crosstalk, routing density, and integration constraints will be evaluated. The project will combine electromagnetic simulation with system-level analysis to identify key design trade-offs and develop guidelines for RF-interposer-enabled CPO architectures.

The outcome will provide insight into how RF interposer technology can support the evolution from compact optical-engine integration toward scalable, high-bandwidth optical connectivity for future AI systems. This direction is consistent with current research examining CPO as an enabling technology for high-performance computing and AI. Co-packaged optics for high-performance computing and artificial intelligence.

Type of internship: Master internship

Duration: 6-12 months

Required educational background: Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology

University promotor: Nadine Collaert (VUB)

Supervising scientist(s): For further information or for application, please contact Xiao Sun (< email slettet af sikkerhedsmæssige årsager >)

The reference code for this position is 2026-INT-338. Mention this reference code in your application.

Applications should include the following information:
  • resume
  • motivation
  • current study

Incomplete applications will not be considered.

Ansøgningsfrist

Så længe stillingen er online

Uddannelsesniveau

Kandidatuddannelsesniveau eller tilsvarende

Funktion

Elektronik & Signalbehandling

Flere oplysninger om virksomheden

imec

Embracing a better life.

Our future starts with you
How would you describe imec in just one word? We asked our employees, see what imec means to the people behind the chips.
Spearheading semiconductor R&D with the world's most advanced pilot line
Imec Leuven (headquarters) from the sky. Soon this view will change, as new buildings will be added in the near future.
Imec's headquarters in Leuven: the imec tower and one of our cleanrooms. But there's lots of imec buildings hiding behind it!
Into imec's cleanroom! Wafers are being processed 24/7.
From chips to atoms: a tour inside imec's material and components analysis labs.
Diversity as fuel for innovation.
We're defining the future for a better life through technology.