Position description
Category
Intrumentation, metrology and control
Contract
Internship
Job title
Sub-30 nm sample preparation and limited-angle STEM tomography H/F
Subject
Prepare sub-30-nm FIB lamellae and use limited-angle STEM tomography to reduce projection effects in nanoscale semiconductor devices.
Contract duration (months)
6
Job description
As semiconductor devices become smaller and more complex, structural information from 2D STEM images becomes harder to interpret because projection effects and overlapping features through conventional FIB lamellae can obscure nanoscale structures.
The internship will improve both sample preparation and STEM characterization. Lamellae thinner than 30 nm will be prepared using FIB milling followed by low-energy argon-ion polishing.
Limited-angle electron tomography will then reconstruct the central slice of the FIB lamella to reduce projection effects. The results will be compared with a full 3D volume reconstructed using deep-learning approaches.
Methods / Means
Electron microscopy (FIB-SEM, STEM), deep-learning approaches
Applicant Profile
Master 2 in materials science, physics or equivalent, with programming skills.
Position location
Site
Grenoble
Job location
France
Location
Grenoble
Candidate criteria
Prepared diploma
Bac+5 - Master 2
Recommended training
Materials science, physics
PhD opportunity
Oui
Requester
Position start date
01/03/2027
Category
Intrumentation, metrology and control
Contract
Internship
Job title
Sub-30 nm sample preparation and limited-angle STEM tomography H/F
Subject
Prepare sub-30-nm FIB lamellae and use limited-angle STEM tomography to reduce projection effects in nanoscale semiconductor devices.
Contract duration (months)
6
Job description
As semiconductor devices become smaller and more complex, structural information from 2D STEM images becomes harder to interpret because projection effects and overlapping features through conventional FIB lamellae can obscure nanoscale structures.
The internship will improve both sample preparation and STEM characterization. Lamellae thinner than 30 nm will be prepared using FIB milling followed by low-energy argon-ion polishing.
Limited-angle electron tomography will then reconstruct the central slice of the FIB lamella to reduce projection effects. The results will be compared with a full 3D volume reconstructed using deep-learning approaches.
Methods / Means
Electron microscopy (FIB-SEM, STEM), deep-learning approaches
Applicant Profile
Master 2 in materials science, physics or equivalent, with programming skills.
Position location
Site
Grenoble
Job location
France
Location
Grenoble
Candidate criteria
Prepared diploma
Bac+5 - Master 2
Recommended training
Materials science, physics
PhD opportunity
Oui
Requester
Position start date
01/03/2027
