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[NanoIC topic] Defect analysis and mechanical modeling of high aspect ratio structure stability

Research / Doctorate 25 to 36 months

Leuven (Belgium)

Published on 2 September 2026

  • Contract

    Research / Doctorate 25 to 36 months

  • Location

    Leuven (Belgium)

  • Start date

    As soon as possible

  • Salary

    Information not provided

  • Remote working

    Not specified

As CMOS scaling progresses, increasing structural aspectratio (AR) and decreasing critical dimensions (CD) pose great challenges formechanical stability and defectivity control. High-AR structures are particularlysusceptible to collapse and damage during processing steps such as etching,cleaning, and drying.

High-throughput SEM-based defectivity inspection toolsproduce large image datasets, requiring automated algorithms for defectextraction and statistical analysis. By correlating these results with CD-SEM,X-SEM, and OCD metrology, stability criteria can be defined for various processconditions. This internship/thesis focuses on developing a data-drivendefectivity analysis pipeline to better understand the mechanical stability ofnanostructures under different process conditions.

Required Skills
  • Strong analytical and programming skills
  • Experience with image processing and/orstatistical analysis techniques

Type of internship: Master internship, PhD internship

Duration: >6 month

Required educational background: Physics, Mechanical Engineering, Materials Engineering

Supervising scientist(s): For further information or for application, please contact XiuMei Xu (< email deleted for security reasons >)

The reference code for this position is 2026-INT-076. Mention this reference code in your application.

Only for self-supporting students.

Applications should include the following information:
  • resume
  • motivation
  • current study

Incomplete applications will not be considered.

Application deadline

As long as the job is online

Study level

Master level or equivalent

Job Category

Technology

More about the company

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